PackageDIP
MountingThrough Hole
PolarityNon-Inverting
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Technical Specifications
Toshiba TC74HCT646AP(F) technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
DIP
Package Description
Dual In Line Package
Lead Shape
Through Hole
Pin Count
24
PCB
24
Package Length (mm)
30.3(Max)
Package Width (mm)
6.4
Package Height (mm)
3.5
Seated Plane Height (mm)
4.15
Pin Pitch (mm)
2.54
Mounting
Through Hole
Logic Family
HCT
Logic Function
Bus Transceiver/Register
Data Flow Direction
Bi-Directional
Number of Elements per Chip
1
Triggering Type
Positive-Edge
Polarity
Non-Inverting
Process Technology
CMOS
Output Type
3-State
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TC74HCT646AP(F) Datasheet
Download the complete datasheet for Toshiba TC74HCT646AP(F) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.