PackageTSSOP
MountingSurface Mount
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Technical Specifications
Toshiba TC74LCX163245FT(SP technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12.8(Max)
Package Width (mm)
6.1
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153ED
Logic Family
LCX
Logic Function
Voltage Level Translator
Process Technology
CMOS
Output Type
3-State
Maximum Low Level Output Current
24mA
Maximum High Level Output Current
-24mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC74LCX163245FT(SP Datasheet
Download the complete datasheet for Toshiba TC74LCX163245FT(SP to view detailed technical specifications.
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