
D-Type Bus Interface Flip-Flop, positive-edge triggered, featuring a single 8-bit element with 3-state, non-inverting outputs. This CMOS logic IC is housed in a 20-pin SOL (Small Outline IC) package with gull-wing leads, designed for surface mounting. The lead-frame SMT package family offers a 1.27mm pin pitch and dimensions of 12.8mm length, 7.5mm width, and 2.3mm height. Operating across a temperature range of -40°C to 85°C, this component is suitable for various electronic applications.
Toshiba TC74LCX374FW(X) technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOL |
| Package Description | Small Outline IC (L Lead) |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 12.8 |
| Package Width (mm) | 7.5 |
| Package Height (mm) | 2.3 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Family | LCX |
| Logic Function | D-Type Bus Interface |
| Process Technology | CMOS |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 8 |
| Number of Element Outputs | 8 |
| Output Type | 3-State |
| Polarity | Non-Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Download the complete datasheet for Toshiba TC74LCX374FW(X) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.