Bi-directional, 8-channel, 3-state bus transceiver IC. Features CMOS process technology and LVX logic family for non-inverting, bi-directional data flow. Housed in a 20-pin TSSOP (Thin Shrink Small Outline Package) with gull-wing leads for surface mounting. Package dimensions include a maximum length of 6.9mm, width of 4.4mm, and height of 1mm, with a 0.65mm pin pitch. Operates within a temperature range of -40°C to 85°C.
PackageTSSOP
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Toshiba TC74LVX245FT(SOE) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
6.9(Max)
Package Width (mm)
4.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AC
Logic Family
LVX
Logic Function
Bus Transceiver
Data Flow Direction
Bi-Directional
Number of Elements per Chip
1
Polarity
Non-Inverting
Process Technology
CMOS
Output Type
3-State
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC74LVX245FT(SOE) Datasheet
Download the complete datasheet for Toshiba TC74LVX245FT(SOE) to view detailed technical specifications.
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