Single 18-channel, 3-state, bi-directional universal bus transceiver featuring CMOS process technology and VCX logic family. This surface-mount integrated circuit utilizes a Thin Shrink Small Outline Package (TSSOP) with 56 gull-wing leads, measuring 14mm x 6.1mm x 1mm. It operates with positive-edge triggering and non-inverting polarity, supporting 3.6V tolerant I/Os across an industrial temperature range of -40°C to 85°C.
PackageTSSOP
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Toshiba TC74VCXR162501FT(E technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
56
PCB
56
Package Length (mm)
14
Package Width (mm)
6.1
Package Height (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153EE
Logic Family
VCX
Logic Function
Universal Bus Transceiver
Data Flow Direction
Bi-Directional
Number of Elements per Chip
1
Triggering Type
Positive-Edge
Polarity
Non-Inverting
Process Technology
CMOS
Output Type
3-State
Tolerant I/Os
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC74VCXR162501FT(E Datasheet
Download the complete datasheet for Toshiba TC74VCXR162501FT(E to view detailed technical specifications.
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