CMOS logic inverter featuring a single element, surface-mount design in a 5-pin SMV (SSOP) package. This component utilizes VHCT logic family technology and offers a gull-wing lead shape for reliable solder joint formation. With a compact plastic package measuring 2.9mm x 1.6mm x 1.1mm and a 0.95mm pin pitch, it is suitable for space-constrained applications. Operating across a temperature range of -40°C to 85°C, it supports output currents of up to 8mA.
PackageSMV
MountingSurface Mount
Quick Jump:
Technical Specifications
Toshiba TC7SET04F(T5LND1,F technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SSOP |
| Package/Case | SMV |
| Package Description | Small Outline Transistor |
| Lead Shape | Gull-wing |
| Pin Count | 5 |
| PCB | 5 |
| Package Length (mm) | 2.9 |
| Package Width (mm) | 1.6 |
| Package Height (mm) | 1.1 |
| Seated Plane Height (mm) | 1.15 |
| Pin Pitch (mm) | 0.95 |
| Package Weight (g) | 0.014 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | SOT-25 |
| Logic Family | VHCT |
| Logic Function | Inverter |
| Process Technology | CMOS |
| Number of Elements per Chip | 1 |
| Maximum High Level Output Current | -8mA |
| Maximum Low Level Output Current | 8mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Toshiba TC7SET04F(T5LND1,F Datasheet
Download the complete datasheet for Toshiba TC7SET04F(T5LND1,F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.