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Technical Specifications
Toshiba TC7SP332WBG technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WCSP |
| Lead Shape | Ball |
| Pin Count | 6 |
| PCB | 6 |
| Package Length (mm) | 1.2 |
| Package Width (mm) | 0.8 |
| Package Height (mm) | 0.42(Max) |
| Mounting | Surface Mount |
| Logic Function | Level Translator |
| Process Technology | CMOS |
| Maximum Low Level Output Current | 12mA |
| Maximum High Level Output Current | -12mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba TC7SP332WBG Datasheet
Download the complete datasheet for Toshiba TC7SP332WBG to view detailed technical specifications.
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