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Technical Specifications
Toshiba TC7WG00FK(BRA) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | US |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 2 |
| Package Width (mm) | 2.3 |
| Package Height (mm) | 0.7 |
| Seated Plane Height (mm) | 0.75 |
| Pin Pitch (mm) | 0.5 |
| Package Weight (g) | 0.01 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Function | NAND |
| Process Technology | CMOS |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 2-IN |
| Number of Element Outputs | 1 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Toshiba TC7WG00FK(BRA) Datasheet
Download the complete datasheet for Toshiba TC7WG00FK(BRA) to view detailed technical specifications.
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