
8-pin US package, surface mount CMOS buffer IC featuring three non-inverting buffer elements. This shrink small outline package (SOP) utilizes gull-wing leads and a 0.5mm pin pitch, with dimensions of 2mm length, 2.3mm width, and 0.7mm height. Operating within a -40°C to 85°C temperature range, it supports 5.5V tolerant inputs and is built on VHC logic technology.
Toshiba TC7WH34FK(T5RSON,F technical specifications.
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