8-pin US package, surface mount CMOS buffer IC featuring three non-inverting buffer elements. This shrink small outline package (SOP) utilizes gull-wing leads and a 0.5mm pin pitch, with dimensions of 2mm length, 2.3mm width, and 0.7mm height. Operating within a -40°C to 85°C temperature range, it supports 5.5V tolerant inputs and is built on VHC logic technology.
PackageUS
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Toshiba TC7WH34FK(T5RSON,F technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
US
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
2
Package Width (mm)
2.3
Package Height (mm)
0.7
Seated Plane Height (mm)
0.75
Pin Pitch (mm)
0.5
Package Weight (g)
0.01
Package Material
Plastic
Mounting
Surface Mount
Jedec
SC-65
Logic Family
VHC
Logic Function
Buffer
Number of Elements per Chip
3
Number of Inputs per Chip
3
Number of Outputs per Chip
3
Process Technology
CMOS
Polarity
Non-Inverting
Tolerant I/Os
5.5 InputsV
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC7WH34FK(T5RSON,F Datasheet
Download the complete datasheet for Toshiba TC7WH34FK(T5RSON,F to view detailed technical specifications.
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