Automotive-grade D-Type positive-edge triggered flip-flop IC, featuring a single element with CMOS process technology and VHC logic family. This surface-mount component is housed in an 8-pin Shrink Small Outline Package (SOP) with gull-wing leads, measuring 2mm x 2.3mm x 0.7mm with a 0.5mm pin pitch. Operating across a temperature range of -40°C to 85°C, it offers inverting/non-inverting polarity and is designed for lead-frame SMT mounting.
PackageUS
MountingSurface Mount
PolarityInverting/Non-Inverting
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Technical Specifications
Toshiba TC7WH74FK(T5LSAM,F technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
US
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
2
Package Width (mm)
2.3
Package Height (mm)
0.7
Seated Plane Height (mm)
0.75
Pin Pitch (mm)
0.5
Package Weight (g)
0.01
Package Material
Plastic
Mounting
Surface Mount
Jedec
SC-65
Logic Family
VHC
Logic Function
D-Type
Process Technology
CMOS
Number of Elements per Chip
1
Number of Element Inputs
1
Number of Element Outputs
1
Polarity
Inverting/Non-Inverting
Triggering Type
Positive-Edge
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC7WH74FK(T5LSAM,F Datasheet
Download the complete datasheet for Toshiba TC7WH74FK(T5LSAM,F to view detailed technical specifications.
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