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Technical Specifications
Toshiba TC9327F-113(BS,DRY technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LQFP |
| Package Description | Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 80 |
| PCB | 80 |
| Package Length (mm) | 12 |
| Package Width (mm) | 12 |
| Package Height (mm) | 1.4 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BDD |
| Min Operating Temperature | -10°C |
| Max Operating Temperature | 60°C |
Compliance
| Cage Code | S0562 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba TC9327F-113(BS,DRY Datasheet
Download the complete datasheet for Toshiba TC9327F-113(BS,DRY to view detailed technical specifications.
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