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Technical Specifications
Toshiba TD62008AFG(5) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOP |
| Package Description | Plastic Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 10.5(Max) |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 1.5 |
| Seated Plane Height (mm) | 1.9(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | NPN |
| Configuration | Array 7 |
| Number of Elements per Chip | 7 |
| Maximum Collector-Emitter Voltage | 50V |
| Maximum Continuous DC Collector Current | 0.4A |
| Maximum Power Dissipation | 625mW |
| Minimum DC Current Gain | 1000@350mA@4V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| Schedule B | 8541210080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba TD62008AFG(5) Datasheet
Download the complete datasheet for Toshiba TD62008AFG(5) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.