NPN Darlington transistor array featuring a 50V collector-emitter voltage and 1.5A continuous DC collector current. This surface-mount component offers 1400mW maximum power dissipation and a minimum DC current gain of 800 (typical). Housed in an 18-pin HSOP package with gull-wing leads, it provides four NPN elements per chip, suitable for lead-frame SMT applications. Operating temperature range is -40°C to 85°C.
PackageHSOP
MountingSurface Mount
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Technical Specifications
Toshiba TD62064AF(F,PP,SEL technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
HSOP
Package/Case
HSOP
Package Description
Heat Sinked Small Outline Package
Lead Shape
Gull-wing
Pin Count
18
PCB
16
Tab
2Tab
Package Length (mm)
13.5(Max)
Package Width (mm)
6.4
Package Height (mm)
2.3
Seated Plane Height (mm)
2.85(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Type
NPN
Configuration
Quad
Number of Elements per Chip
4
Maximum Collector-Emitter Voltage
50V
Maximum Continuous DC Collector Current
1.5A
Maximum Power Dissipation
1400mW
Maximum Collector-Emitter Saturation Voltage
Minimum DC Current Gain
800(Typ)@1A@2V|1500(Typ)@0.25A@2V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
Schedule B
8541290080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TD62064AF(F,PP,SEL Datasheet
Download the complete datasheet for Toshiba TD62064AF(F,PP,SEL to view detailed technical specifications.
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