PackageHSOP
MountingSurface Mount
Quick Jump:
Technical Specifications
Toshiba TD62064BF(F,O,EL) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
HSOP
Package/Case
HSOP
Package Description
Heat Sinked Small Outline Package
Lead Shape
Gull-wing
Pin Count
18
PCB
16
Tab
2Tab
Package Length (mm)
13
Package Width (mm)
6.4
Package Height (mm)
2.3
Package Material
Plastic
Mounting
Surface Mount
Type
NPN
Configuration
Quad
Number of Elements per Chip
4
Maximum Collector-Emitter Voltage
80V
Maximum Continuous DC Collector Current
1.5A
Maximum Power Dissipation
1400mW
Maximum Collector-Emitter Saturation Voltage
Minimum DC Current Gain
1500(Typ)@1.25A@2V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
Schedule B
8541290080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TD62064BF(F,O,EL) Datasheet
Download the complete datasheet for Toshiba TD62064BF(F,O,EL) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.