NPN Bipolar Junction Transistor (BJT) array, featuring an octal configuration with 8 elements per chip. This surface-mount component offers a maximum collector-emitter voltage of 50V and a continuous DC collector current of 0.5A, with a maximum power dissipation of 960mW. The SSOP package, a Shrink Small Outline Package, measures 6.8mm in length and 4.4mm in width, with a 0.65mm pin pitch, suitable for lead-frame SMT mounting. Key electrical characteristics include a minimum DC current gain of 1000 at 350mA/2V and a maximum collector-emitter saturation voltage of 1.1V at 100mA.
PackageSSOP
MountingSurface Mount
Quick Jump:
Technical Specifications
Toshiba TD62083AFNG(PP,S) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 18 |
| PCB | 18 |
| Package Length (mm) | 6.8(Max) |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 1.2 |
| Seated Plane Height (mm) | 1.55(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Weight (g) | 0.09 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | NPN |
| Configuration | Octal |
| Number of Elements per Chip | 8 |
| Maximum Collector-Emitter Voltage | 50V |
| Maximum Continuous DC Collector Current | 0.5A |
| Maximum Power Dissipation | 960mW |
| Maximum Collector-Emitter Saturation Voltage | 1.1@100mA|1.3@200mA|1.6@350mAV |
| Minimum DC Current Gain | 1000@350mA@2V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| Schedule B | 8541210080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba TD62083AFNG(PP,S) Datasheet
Download the complete datasheet for Toshiba TD62083AFNG(PP,S) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.