PackageHSOP
MountingSurface Mount
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Technical Specifications
Toshiba TD62308AFG(OS,R,EL technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
HSOP
Package/Case
HSOP
Package Description
Heat Sinked Small Outline Package
Lead Shape
Gull-wing
Pin Count
18
PCB
16
Tab
2Tab
Package Length (mm)
13
Package Width (mm)
6.4
Package Height (mm)
2.3
Package Material
Plastic
Mounting
Surface Mount
Type
NPN|PNP
Configuration
Quad
Number of Elements per Chip
4
Maximum Collector-Emitter Voltage
50V
Maximum Continuous DC Collector Current
1.5A
Maximum Power Dissipation
1400mW
Maximum Collector-Emitter Saturation Voltage
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
Schedule B
8541290080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TD62308AFG(OS,R,EL Datasheet
Download the complete datasheet for Toshiba TD62308AFG(OS,R,EL to view detailed technical specifications.
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