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Technical Specifications
Toshiba TD62381P(J) technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
18
PCB
18
Package Length (mm)
24.6
Package Width (mm)
6.4
Package Height (mm)
3.5
Package Material
Plastic
Mounting
Through Hole
Jedec
MS-001AC
Type
NPN
Configuration
Octal
Number of Elements per Chip
8
Maximum Collector-Emitter Voltage
15V
Maximum Continuous DC Collector Current
0.5A
Maximum Power Dissipation
520mW
Maximum Collector-Emitter Saturation Voltage
0.9@500mA|0.7@350mAV
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
Schedule B
8541210080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TD62381P(J) Datasheet
Download the complete datasheet for Toshiba TD62381P(J) to view detailed technical specifications.
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