Octal NPN/PNP Darlington transistor array for surface mount applications. Features 50V collector-emitter voltage and 0.5A continuous collector current. Offers 960mW maximum power dissipation with a 20-pin SSOP package. The Shrink Small Outline Package has a 1.27mm pin pitch and gull-wing leads. Operates within a -40°C to 85°C temperature range.
PackageSSOP
MountingSurface Mount
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Technical Specifications
Toshiba TD62388AFNG(5) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 7(Max) |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 1.2 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Weight (g) | 0.1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | NPN|PNP |
| Configuration | Octal |
| Number of Elements per Chip | 8 |
| Maximum Collector-Emitter Voltage | 50V |
| Maximum Continuous DC Collector Current | 0.5A |
| Maximum Power Dissipation | 960mW |
| Maximum Collector-Emitter Saturation Voltage | 2@350mAV |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| Schedule B | 8541210080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba TD62388AFNG(5) Datasheet
Download the complete datasheet for Toshiba TD62388AFNG(5) to view detailed technical specifications.
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