NPN digital transistor array featuring 7 configurations, designed for through-hole mounting. This component offers a maximum collector-emitter voltage of 35V and a maximum continuous DC collector current of 200mA. It operates within a temperature range of -40°C to 85°C and is housed in a 16-pin PDIP plastic package with a 2.54mm pin pitch. Key specifications include a typical input resistor of 10.5 kOhm and a maximum power dissipation of 1000mW.
PackagePDIP
MountingThrough Hole
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Technical Specifications
Toshiba TD62504P(J) technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
16
PCB
16
Package Length (mm)
19.75(Max)
Package Width (mm)
6.4
Package Height (mm)
3.5
Seated Plane Height (mm)
4.15
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Jedec
MS-001BB
Type
NPN
Configuration
Array 7
Maximum Collector-Emitter Voltage
35V
Maximum Continuous DC Collector Current
200mA
Maximum Power Dissipation
1000mW
Typical Input Resistor
10.5kOhm
Typical Resistor Ratio
1.05
Maximum Collector-Emitter Saturation Voltage
0.2@1mA@10mA|0.8@3mA@150mAV
Minimum DC Current Gain
50@10mA@10V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
Schedule B
8541290080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TD62504P(J) Datasheet
Download the complete datasheet for Toshiba TD62504P(J) to view detailed technical specifications.
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