PackageSOP
MountingSurface Mount
Quick Jump:
Technical Specifications
Toshiba TD62706F(TOYOG,TP2 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOP
Package Description
Plastic Small Outline Package
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
10
Package Width (mm)
4.4
Package Height (mm)
1.5
Seated Plane Height (mm)
1.9(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Type
NPN|PNP
Configuration
Hex
Number of Elements per Chip
6
Maximum Continuous DC Collector Current
0.05A
Maximum Power Dissipation
625mW
Maximum Collector-Emitter Saturation Voltage
22.5@40mAV
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
Schedule B
8541210080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TD62706F(TOYOG,TP2 Datasheet
Download the complete datasheet for Toshiba TD62706F(TOYOG,TP2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.