PackageSSOP
MountingSurface Mount
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Technical Specifications
Toshiba TD62783AFNG(S) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
18
PCB
18
Package Length (mm)
6.8(Max)
Package Width (mm)
4.4
Package Height (mm)
1.2
Seated Plane Height (mm)
1.5(Max)
Package Material
Plastic
Mounting
Surface Mount
Type
NPN|PNP
Configuration
Octal Common Emitter
Number of Elements per Chip
8
Maximum Continuous DC Collector Current
0.5A
Maximum Power Dissipation
960mW
Maximum Collector-Emitter Saturation Voltage
1.8@100mA|1.9@225mA|2@350mAV
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
Schedule B
8541210080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TD62783AFNG(S) Datasheet
Download the complete datasheet for Toshiba TD62783AFNG(S) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.