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Technical Specifications
Toshiba TD62930FG(5) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
8.7(Max)
Package Width (mm)
4.6
Package Height (mm)
1.5
Seated Plane Height (mm)
1.9(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Category
IGBT Gate Driver
Min Operating Temperature
-20°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TD62930FG(5) Datasheet
Download the complete datasheet for Toshiba TD62930FG(5) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.