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Technical Specifications
Toshiba TD62930P(J) technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
16
PCB
16
Package Length (mm)
19.75(Max)
Package Width (mm)
6.4
Package Height (mm)
3.5
Seated Plane Height (mm)
4.15
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Jedec
MS-001BB
Category
IGBT Gate Driver
Min Operating Temperature
-20°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TD62930P(J) Datasheet
Download the complete datasheet for Toshiba TD62930P(J) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.