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Technical Specifications
Toshiba TD62M8600F(F) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | HSOP |
| Package/Case | HSOP |
| Package Description | Heat Sinked Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 18 |
| PCB | 16 |
| Tab | 2Tab |
| Package Length (mm) | 13 |
| Package Width (mm) | 6.4 |
| Package Height (mm) | 2.3 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | PNP |
| Configuration | Octal |
| Maximum Collector-Emitter Voltage | 10V |
| Maximum Continuous DC Collector Current | 2000mA |
| Maximum Power Dissipation | 900mW |
| Maximum Collector-Emitter Saturation Voltage | 0.25@25mA@1A|0.5@50mA@2AV |
| Minimum DC Current Gain | [email protected]@1V|[email protected]@1V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8541210075 |
| Schedule B | 8541210080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Toshiba TD62M8600F(F) Datasheet
Download the complete datasheet for Toshiba TD62M8600F(F) to view detailed technical specifications.
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