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Technical Specifications
Toshiba TLP176G(SIEM-TP) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOP |
| Package Description | Plastic Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 4 |
| PCB | 4 |
| Package Length (mm) | 3.9 |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 1.9(Max) |
| Seated Plane Height (mm) | 2.1(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Maximum Input Voltage | 1.3V |
| I/O Isolation Voltage | 1500(RMS)V |
| Maximum Output Voltage | 350V |
| Maximum Input Current | 50mA |
| Maximum Output Current | 0.12A |
| Input Type | DC |
| Output Device | MOSFET |
| Circuit Arrangement | 1 Form A |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8536410060 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Toshiba TLP176G(SIEM-TP) Datasheet
Download the complete datasheet for Toshiba TLP176G(SIEM-TP) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.