PackageSOP
MountingSurface Mount
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Technical Specifications
Toshiba TLP176G(TEE-TP) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOP
Package Description
Plastic Small Outline Package
Lead Shape
Gull-wing
Pin Count
4
PCB
4
Package Length (mm)
3.9
Package Width (mm)
4.4
Package Height (mm)
1.9(Max)
Seated Plane Height (mm)
2.1(Max)
Package Material
Plastic
Mounting
Surface Mount
Maximum Input Voltage
1.3V
I/O Isolation Voltage
1500(RMS)V
Maximum Output Voltage
350V
Maximum Input Current
50mA
Maximum Output Current
0.12A
Input Type
DC
Output Device
MOSFET
Circuit Arrangement
1 Form A
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8536410060
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TLP176G(TEE-TP) Datasheet
Download the complete datasheet for Toshiba TLP176G(TEE-TP) to view detailed technical specifications.
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