PackageSDIP
MountingThrough Hole
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Technical Specifications
Toshiba TMP82C255AN-2(HA) technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
SDIP
Package Description
Skinny Dual In Line Package
Pin Count
64
PCB
64
Package Length (mm)
58(Max)
Package Width (mm)
17.8
Package Height (mm)
4
Seated Plane Height (mm)
4.7
Mounting
Through Hole
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Category
CMOS Programmable Peripheral Interface
Compliance
Cage Code
S0562
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TMP82C255AN-2(HA) Datasheet
Download the complete datasheet for Toshiba TMP82C255AN-2(HA) to view detailed technical specifications.
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