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Technical Specifications
Toshiba TMP86P807NG(ZO) technical specifications.
General
Package Family Name
DIP
Package/Case
SDIP
Package Description
Skinny Dual In Line Package
Lead Shape
Through Hole
Pin Count
28
PCB
28
Package Length (mm)
26.1(Max)
Package Width (mm)
8.8
Package Height (mm)
3.3
Seated Plane Height (mm)
3.8
Pin Pitch (mm)
1.78
Mounting
Through Hole
Data Bus Width
8bit
Program Memory Type
ROM
Compliance
Cage Code
S0562
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TMP86P807NG(ZO) Datasheet
Download the complete datasheet for Toshiba TMP86P807NG(ZO) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.