PackageLQFP
MountingSurface Mount
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Technical Specifications
Toshiba TMP86PM29BU technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
64
PCB
64
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Mounting
Surface Mount
Jedec
MS-026BCD
Data Bus Width
8bit
Instruction Set Architecture
CISC
Program Memory Type
EPROM
Number of Programmable I/Os
39
Number of Timers
4
Interface Type
SIO/UART
ADC Channels
8
Compliance
Cage Code
S0562
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TMP86PM29BU Datasheet
Download the complete datasheet for Toshiba TMP86PM29BU to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.