PackageSDIP
MountingThrough Hole
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Technical Specifications
Toshiba TMP88CS34NG(Z) technical specifications.
General
Package Family Name
DIP
Package/Case
SDIP
Package Description
Skinny Dual In Line Package
Lead Shape
Through Hole
Pin Count
42
PCB
42
Package Length (mm)
38.5(Max)
Package Width (mm)
14
Package Height (mm)
3.5
Seated Plane Height (mm)
4.2
Pin Pitch (mm)
1.78
Mounting
Through Hole
Jedec
MS-020AB
Family Name
TLCS-870/X
Data Bus Width
8bit
Instruction Set Architecture
CISC
Maximum CPU Frequency
16MHz
Program Memory Type
ROM
Program Memory Size
64KB
Programmability
Yes
Compliance
Cage Code
S0562
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TMP88CS34NG(Z) Datasheet
Download the complete datasheet for Toshiba TMP88CS34NG(Z) to view detailed technical specifications.
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