PackageLQFP
MountingSurface Mount
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Technical Specifications
Toshiba TMP91C630FG(JZ) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
100
PCB
100
Package Length (mm)
14
Package Width (mm)
14
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BED
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TMP91C630FG(JZ) Datasheet
Download the complete datasheet for Toshiba TMP91C630FG(JZ) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.