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Technical Specifications
Toshiba TMPA8700CSF-4NF5(Z technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | SDIP |
| Package Description | Skinny Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 42 |
| PCB | 42 |
| Package Length (mm) | 38.5(Max) |
| Package Width (mm) | 14 |
| Package Height (mm) | 3.5 |
| Seated Plane Height (mm) | 4.2 |
| Pin Pitch (mm) | 1.78 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Jedec | MS-020AB |
Compliance
| Cage Code | S0562 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba TMPA8700CSF-4NF5(Z Datasheet
Download the complete datasheet for Toshiba TMPA8700CSF-4NF5(Z to view detailed technical specifications.
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