The TMPM330FDFG is a microcontroller available in a 100-pin LQFP package with a lead-frame SMT construction. It has a seated plane height of 1.7mm maximum and a pin pitch of 0.5mm. The package is made of plastic and is designed for surface mount applications. The microcontroller is suitable for use in a variety of applications, including those requiring a low profile quad flat package.
PackageLQFP
MountingSurface Mount
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Technical Specifications
Toshiba TMPM330FDFG technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LQFP |
| Package Description | Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 100 |
| PCB | 100 |
| Package Length (mm) | 14 |
| Package Width (mm) | 14 |
| Package Height (mm) | 1.4 |
| Seated Plane Height (mm) | 1.7(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BED |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Toshiba TMPM330FDFG Datasheet
Download the complete datasheet for Toshiba TMPM330FDFG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.