P-channel enhancement mode power MOSFET in an 8-pin SOP package, featuring a 30V drain-source voltage and 11A continuous drain current. This surface-mount component utilizes U-MOS V process technology and offers a low drain-source on-resistance of 12mΩ at 10V. Key electrical characteristics include a typical gate charge of 42nC and input capacitance of 1770pF. The plastic SOP package has a maximum length of 5.5mm and a pin pitch of 1.27mm, suitable for operation between -55°C and 150°C.
PackageSOP
MountingSurface Mount
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Technical Specifications
Toshiba TPC8121(TE12L,Q,M) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOP |
| Package Description | Plastic Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 5.5(Max) |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 1.5 |
| Seated Plane Height (mm) | 1.6 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Configuration | Single Quad Drain Triple Source |
| Category | Power MOSFET |
| Channel Mode | Enhancement |
| Channel Type | P |
| Number of Elements per Chip | 1 |
| Process Technology | U-MOS V |
| Maximum Drain Source Voltage | 30V |
| Maximum Gate Source Voltage | ±20V |
| Maximum Continuous Drain Current | 11A |
| Material | Si |
| Maximum Gate Threshold Voltage | 2V |
| Maximum Drain Source Resistance | 12@10VmOhm |
| Typical Gate Charge @ Vgs | 42@10VnC |
| Typical Gate Charge @ 10V | 42nC |
| Typical Input Capacitance @ Vds | 1770@10VpF |
| Maximum Power Dissipation | 1900mW |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8541290095 |
| Schedule B | 8541290080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Toshiba TPC8121(TE12L,Q,M) Datasheet
Download the complete datasheet for Toshiba TPC8121(TE12L,Q,M) to view detailed technical specifications.
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