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Technical Specifications
Toshiba ULN2003AFW(OV,EL,M technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOL |
| Package Description | Small Outline IC (L Lead) |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 9.9 |
| Package Width (mm) | 3.9 |
| Package Height (mm) | 1.38 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | NPN |
| Configuration | Array 7 |
| Number of Elements per Chip | 7 |
| Maximum Collector-Emitter Voltage | 50V |
| Maximum Continuous DC Collector Current | 0.5A |
| Maximum Power Dissipation | 1250mW |
| Maximum Collector-Emitter Saturation Voltage | 1.1@250uA@100mA|1.3@350uA@200mA|1.6@500uA@350mAV |
| Minimum DC Current Gain | 1000@350mA@2V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes |
| Schedule B | 8541290080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Toshiba ULN2003AFW(OV,EL,M Datasheet
Download the complete datasheet for Toshiba ULN2003AFW(OV,EL,M to view detailed technical specifications.
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