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Technical Specifications
Trident Microsystems P87C766BDR/C technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
SDIP
Package Description
Skinny Dual In Line Package
Lead Shape
Through Hole
Pin Count
42
PCB
42
Package Length (mm)
38.9(Max)
Package Width (mm)
14(Max)
Package Height (mm)
4(Max)
Seated Plane Height (mm)
5.08(Max)
Package Material
Plastic
Mounting
Through Hole
Jedec
MS-020
Compliance
Cage Code
5ZQR0
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Radiation Hardening
No
Datasheet
Trident Microsystems P87C766BDR/C Datasheet
Download the complete datasheet for Trident Microsystems P87C766BDR/C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.