PackageDBSP
MountingThrough Hole
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Technical Specifications
Trident Microsystems TDA8359J/N2,112 technical specifications.
General
| Package Family Name | DBSP |
| Package/Case | DBSP |
| Pin Count | 9 |
| PCB | 9 |
| Package Length (mm) | 13.2(Max) |
| Package Width (mm) | 2.7(Max) |
| Package Height (mm) | 14.7(Max) |
| Mounting | Through Hole |
| Category | Full Bridge Vertical Deflection |
| Min Operating Temperature | -25°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 5ZQR0 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| RoHS Versions | 2002/95/EC |
Datasheet
Trident Microsystems TDA8359J/N2,112 Datasheet
Download the complete datasheet for Trident Microsystems TDA8359J/N2,112 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.