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Technical Specifications
Vishay Si8475EDB technical specifications.
General
Package Family Name
BGA
Package/Case
Micro Foot
Pin Count
4
PCB
4
Package Length (mm)
1.6(Max)
Package Width (mm)
1.6(Max)
Package Height (mm)
0.36(Max)
Seated Plane Height (mm)
0.65(Max)
Pin Pitch (mm)
0.85(Max)
Mounting
Surface Mount
Configuration
Single
Category
Power MOSFET
Channel Mode
Enhancement
Channel Type
P
Number of Elements per Chip
1
Maximum Drain Source Voltage
20V
Maximum Gate Source Voltage
±12V
Maximum Continuous Drain Current
4.9A
Maximum Drain Source Resistance
Maximum Power Dissipation
1100mW
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
18612
HTS Code
8541290095
Schedule B
8541290080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Vishay Si8475EDB Datasheet
Download the complete datasheet for Vishay Si8475EDB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.