PackageTO-220AB
MountingThrough Hole
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Technical Specifications
Ween Semiconductor BUJ303A,127 technical specifications.
General
| Package/Case | TO-220AB |
| Pin Count | 3 |
| PCB | 3 |
| Tab | Tab |
| Package Length (mm) | 10.3(Max) |
| Package Width (mm) | 4.7(Max) |
| Package Height (mm) | 9.4(Max) |
| Package Material | Plastic |
| Mounting | Through Hole |
| Jedec | TO-220AB |
| Type | NPN |
| Configuration | Single |
| Number of Elements per Chip | 1 |
| Maximum Collector-Emitter Voltage | 500V |
| Maximum DC Collector Current | 5A |
| Maximum Power Dissipation | 100000mW |
| Material | Si |
| Minimum DC Current Gain | 10@5mA@5V|14@500mA@5V |
| Category | Bipolar Power |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 150°C |
Compliance
| EU RoHS | Yes with Exemption |
| HTS Code | 8541290075 |
| Schedule B | 8541290080 |
| ECCN | EAR99 |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Ween Semiconductor BUJ303A,127 Datasheet
Download the complete datasheet for Ween Semiconductor BUJ303A,127 to view detailed technical specifications.
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