Frequency40MHz
PackageSOIC
Current18mA
MountingSurface Mount
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Technical Specifications
Winbond W25P10VSNIG technical specifications.
General
Access Time-Max
13ns
Address Bus Width
1b
Package/Case
SOIC
Density
1Mb
Frequency
40MHz
Interface
SPI, Serial
Lead Free
Lead Free
Max Operating Temperature
85°C
Max Supply Voltage
3.6V
Memory Size
1Mb
Memory Type
Non-Volatile, , FLASH
Min Operating Temperature
-40°C
Min Supply Voltage
2.7V
Mount
Surface Mount
Number of Words
128000
Operating Supply Voltage
3.3V
Series
SpiFlash®
Supply Current
18mA
Sync/Async
Synchronous
Word Size
8b
Compliance
RoHS
Compliant
Datasheet
Winbond W25P10VSNIG Datasheet
Download the complete datasheet for Winbond W25P10VSNIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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