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Technical Specifications
Winbond W25P16VSFIG technical specifications.
General
| Access Time | 50us |
| Package/Case | SOIC |
| Frequency | 50MHz |
| Lead Free | Lead Free |
| Max Operating Temperature | 85°C |
| Memory Size | 16Mb |
| Memory Type | Non-Volatile, , FLASH |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| RoHS Compliant | Yes |
| Series | SpiFlash® |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W25P16VSFIG Datasheet
Download the complete datasheet for Winbond W25P16VSFIG to view detailed technical specifications.
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