Frequency50MHz
PackageSOIC
MountingSurface Mount
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Technical Specifications
Winbond W25P16VSSIG technical specifications.
General
Access Time
50us
Address Bus Width
1b
Package/Case
SOIC
Density
16Mb
Frequency
50MHz
Interface
SPI, Serial
Lead Free
Lead Free
Max Operating Temperature
85°C
Memory Size
16Mb
Memory Type
Non-Volatile, , FLASH
Min Operating Temperature
-40°C
Mount
Surface Mount
Radiation Hardening
No
RoHS Compliant
Yes
Series
SpiFlash®
Compliance
RoHS
Compliant
Datasheet
Winbond W25P16VSSIG Datasheet
Download the complete datasheet for Winbond W25P16VSSIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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