128M-bit NOR Flash memory with Serial (SPI, Dual SPI, Quad SPI) interface. Features 16M x 8 organization, 7ns maximum access time, and operates from 2.7V to 3.6V. Housed in an 8-pin WSON EP package with a 1.27mm pin pitch, this surface-mount component offers symmetrical, sectored block architecture and supports boot blocks at the bottom or top. Operating temperature range is -40°C to 85°C.
PackageWSON EP
MountingSurface Mount
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Technical Specifications
Winbond W25Q128FVEIG technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
SON
Package/Case
WSON EP
Package Description
Very Very Thin Small Outline No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
8
PCB
8
Package Length (mm)
6
Package Width (mm)
8
Package Height (mm)
0.73
Seated Plane Height (mm)
0.75
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Density
128Mbit
Interface Type
Serial (SPI, Dual SPI, Quad SPI)
Maximum Operating Current
20mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Synchronous
Maximum Access Time
7ns
Number of Words
16M
Boot Block
Yes
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
24bit
Location of Boot Block
Bottom|Top
Number of Bits per Word
8bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
SDM39
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Winbond W25Q128FVEIG Datasheet
Download the complete datasheet for Winbond W25Q128FVEIG to view detailed technical specifications.
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