128M-bit NOR Flash memory with Serial (SPI, Dual SPI, Quad SPI) interface. Features 16M x 8 organization, 7ns maximum access time, and operates from 2.7V to 3.6V. Housed in an 8-pin WSON EP package with a 1.27mm pin pitch, this surface-mount component offers symmetrical, sectored block architecture and supports boot blocks at the bottom or top. Operating temperature range is -40°C to 85°C.
PackageWSON EP
MountingSurface Mount
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Technical Specifications
Winbond W25Q128FVEIG technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | SON |
| Package/Case | WSON EP |
| Package Description | Very Very Thin Small Outline No Lead Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 6 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.73 |
| Seated Plane Height (mm) | 0.75 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 128Mbit |
| Interface Type | Serial (SPI, Dual SPI, Quad SPI) |
| Maximum Operating Current | 20mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6V |
| Timing Type | Synchronous |
| Maximum Access Time | 7ns |
| Number of Words | 16M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 24bit |
| Location of Boot Block | Bottom|Top |
| Number of Bits per Word | 8bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | SDM39 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Winbond W25Q128FVEIG Datasheet
Download the complete datasheet for Winbond W25Q128FVEIG to view detailed technical specifications.
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