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Technical Specifications
Winbond W25Q128FWSIG technical specifications.
General
Package/Case
SOIC
Interface
SPI, Serial
Max Operating Temperature
85°C
Memory Type
FLASH,
Min Operating Temperature
-40°C
Package Quantity
90
Packaging
Rail/Tube
RoHS Compliant
Yes
Series
SpiFlash®
Compliance
RoHS
Compliant
Datasheet
Winbond W25Q128FWSIG Datasheet
Download the complete datasheet for Winbond W25Q128FWSIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.