Frequency104MHz
PackageSOIC
Current18mA
MountingSurface Mount
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Technical Specifications
Winbond W25Q16BVSSIG technical specifications.
General
Access Time-Max
6ns
Address Bus Width
1b
Package/Case
SOIC
Density
16Mb
Frequency
104MHz
Interface
SPI, Serial
Lead Free
Lead Free
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Memory Size
16Mb
Memory Type
Non-Volatile, , FLASH, NOR
Min Supply Voltage
2.7V
Mount
Surface Mount
Operating Supply Voltage
3.3V
Packaging
Rail/Tube
Page Size
256B
Radiation Hardening
No
RoHS Compliant
Yes
Series
SpiFlash®
Supply Current
18mA
Sync/Async
Synchronous
Word Size
8b
Compliance
RoHS
Compliant
Datasheet
Winbond W25Q16BVSSIG Datasheet
Download the complete datasheet for Winbond W25Q16BVSSIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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