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Technical Specifications
Winbond W25Q256FVEIG technical specifications.
General
Access Time-Max
8.5ns
Address Bus Width
1b
Density
256Mb
Frequency
104MHz
Interface
SPI, Serial
Max Operating Temperature
85°C
Max Supply Voltage
3.6V
Memory Size
256Mb
Memory Type
Non-Volatile, , FLASH
Min Operating Temperature
-40°C
Min Supply Voltage
2.7V
Mount
Surface Mount
Operating Supply Voltage
3.3V
Packaging
Rail/Tube
RoHS Compliant
Yes
Series
SpiFlash®
Supply Current
20mA
Sync/Async
Synchronous
Word Size
8b
Compliance
RoHS
Compliant
Datasheet
Winbond W25Q256FVEIG Datasheet
Download the complete datasheet for Winbond W25Q256FVEIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.