Frequency104MHz
PackageSOIC
Current20mA
MountingSurface Mount
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Technical Specifications
Winbond W25Q256FVFIG technical specifications.
General
Access Time-Max
8.5ns
Address Bus Width
1b
Package/Case
SOIC
Density
256Mb
Frequency
104MHz
Interface
SPI, Serial
Lead Free
Lead Free
Max Operating Temperature
85°C
Memory Size
256Mb
Memory Type
Non-Volatile, , FLASH, NOR
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Min Supply Voltage
2.7V
Mount
Surface Mount
Operating Supply Voltage
3.3V
Packaging
Rail/Tube
Radiation Hardening
No
RoHS Compliant
Yes
Series
SpiFlash®
Supply Current
20mA
Sync/Async
Synchronous
Word Size
8b
Compliance
RoHS
Compliant
Datasheet
Winbond W25Q256FVFIG Datasheet
Download the complete datasheet for Winbond W25Q256FVFIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.