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Technical Specifications
Winbond W25Q256FVFIGTR technical specifications.
General
| Package/Case | SOIC |
| Density | 256Mb |
| Frequency | 104MHz |
| Interface | SPI, Serial |
| Max Operating Temperature | 85°C |
| Memory Size | 256Mb |
| Memory Type | FLASH, , Non-Volatile, NOR |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Operating Supply Voltage | 3V |
| Package Quantity | 1000 |
| Packaging | Tape and Reel |
| Page Size | 256B |
| Series | SpiFlash® |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W25Q256FVFIGTR Datasheet
Download the complete datasheet for Winbond W25Q256FVFIGTR to view detailed technical specifications.
No datasheet is available for this part.