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Technical Specifications
Winbond W25Q32DWSFIG technical specifications.
General
| Access Time-Max | 7.5ns |
| Address Bus Width | 24b |
| Package/Case | SOIC |
| Density | 32Mb |
| Frequency | 104MHz |
| Interface | SPI, Serial |
| Max Operating Temperature | 85°C |
| Max Supply Voltage | 1.95V |
| Memory Size | 32Mb |
| Memory Type | Non-Volatile, , FLASH, NOR |
| Min Operating Temperature | -40°C |
| Min Supply Voltage | 1.7V |
| Mount | Surface Mount |
| Operating Supply Voltage | 1.8V |
| Packaging | Rail/Tube |
| RoHS Compliant | Yes |
| Series | SpiFlash® |
| Supply Current | 40mA |
| Sync/Async | Synchronous |
| Word Size | 8b |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W25Q32DWSFIG Datasheet
Download the complete datasheet for Winbond W25Q32DWSFIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.