Frequency104MHz
PackageSOIC
MountingSurface Mount
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Technical Specifications
Winbond W25Q32DWSSIG technical specifications.
General
Address Bus Width
24b
Package/Case
SOIC
Density
32Mb
Frequency
104MHz
Interface
SPI, Serial
Max Operating Temperature
85°C
Memory Size
32Mb
Memory Type
Non-Volatile, , FLASH
Min Operating Temperature
-40°C
Mount
Surface Mount
Operating Supply Voltage
1.8V
Packaging
Rail/Tube
Page Size
256B
Radiation Hardening
No
RoHS Compliant
Yes
Series
SpiFlash®
Compliance
RoHS
Compliant
Datasheet
Winbond W25Q32DWSSIG Datasheet
Download the complete datasheet for Winbond W25Q32DWSSIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.